There are many PCB surface finish techniques to guarantee optimal performance and increase service lifespan.
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Todays guide focuses on ENIG surface technique keep reading to learn more.
Electroless Nickel Immersion Gold (ENIG) is a form of PCB surface plating that protects them from corrosion and other defects.
It comprises of a double layer metallic coating where a thin gold layer covers an electroless nickel layer.
The electroless nickel shields the copper pads from oxidation and provides a good soldering surface for the components.
Gold helps in protecting the nickel from oxidation especially during storage.
This facilitates an outstanding and durable electrical performance of the PCB that lasts for many years.
This plating method dominates the market in the PCB industry, thanks to RoHS compliance and its versatility with component assembly.
PCB with ENIGTo achieve an ENIG finish on your PCB, there are several steps that you should follow.
For each of these steps, you need cautious designing, controlling, and monitoring to attain a desirable finish.
The process steps include;
The PCB first undergoes a cleaning process.
Cleaning helps to remove dust, fingerprints, oxidation residues, and further wet the surface to remove trapped air in the through-holes.
There needs to be careful consideration of the micro-etching base of which sulfuric/peroxide is the best choice.
You should monitor and maintain the dwell-time, operating temperature, bath life, and make-up for this step to be effective.
This is because they cause oxidation which interferes with the palladium catalysts deposits in the next process.
You may also involve a catalyst pre-dip to remove the rinse water, oxidation traces and to acidify the surface.
This bath creates a basis for which the nickel and later gold will deposit.
You should ensure proper rinsing of the surface after the bath to avoid palladium residues into the electroless nickel step.
The hypo-phosphate distributes the necessary electrons to reduce the nickel ion to nickel metal. Also, the specific temperate to facilitate this reaction should range between 175°F and 185°F in a weakly acidic pH solution.
In this step, the oxidation of nickel-metal to nickel ion produces electrons that facilitate the gold reduction in a solution.
These electrons reduce gold ions to a consistent gold metal layer protecting the nickel until the soldering process.
The gold thickness should match specific criteria to enable the nickel to keep its solderability.
There is an array of benefits that this type of finish offers.
Some of the benefits that make it one of the most dependable plating methods are;
ENIG PCBThis type of plating achieves an even flat layer that enables the PCB to be compatible with complex surface components.
Some of the components that require such surface planarity are ball grid array (BGA) mounting and flip chips.
The immersion gold layer prevents the nickel surface from any oxidation.
This limits the chances of corrosion occurring on the board. Having this property prolongs the shelf life of the PCB.
This type of surface finish facilitates good electrical conduction among the components on the board.
This makes it a better choice which manufacturers would opt for comparing to other types of finish.
ENIG has a good thermal diffusion property enabling it to withstand extreme temperature conditions.
This property enables it to preserve the functionality of the PCB regardless of environment conditions thus making it reliable.
This plating safeguards your PCB from any external defects including corrosions enabling it to last longer before its use.
You can keep them on storage for an average of 12 months or more.
This finishing method does not use lead in any of its process steps.
Therefore, you eliminate the exposure of lead, a harmful and fatal substance to human beings.
ENIG plating provides a perfect solder surface making it easier for manufacturers to effectively work on the plated through holes.
This surface finish is widely suitable for use across electronic products.
Its ease of precise fitting and reliable performance make it desirable for computers, smartphones, medical appliances, etc.
This form of surface finish satisfies all the Restrictions of Hazardous Substances (RoHS) requirements for manufacturing PCBs.
Manufacturers, therefore, widely utilize this plating method when fabricating printed circuit boards.
This type of PCB plating has its share of shortfalls. Some of its disadvantages are:
This can further cause surface fracturing and the connections to malfunction.
The Restrictions of Hazardous Substances (RoHS) is a regulation restricting the use of hazardous substances in electric and electronic devices.
Ten poisonous substances including Lead, Mercury, Cadmium, Hexavalent chromium, etc. fall under this restriction.
Using these substances to finish your PCB poses a high health risk to the manufacturers and consumers.
ENIG surface finish is RoHS compliant meaning that they are safe for use and handling without great risk.
Yes, this type of plating is Lead-free.
It conforms to the RoHS directive for manufacturing PCBs making it environmentally friendly and offering a wide scope for use.
This surface finish also enjoys a large dominance in the PCB industry due to this characteristic.
There are two main materials manufacturers use in this type of PCB plating, that is Nickel and Gold.
The nickel goes through an auto-catalytic chemical reaction in a liquid bath forming a nickel layer on the copper surface.
This electroless nickel layer prevents the copper surface from getting into contact with compounds that may cause oxidation.
An additional gold layer protects the nickel layer from oxidation while on storage and also provides a low contact resistance.
These are two different surface plating methods that you can use to finish your PCB. They compare in the following ways;
HASL PCB surface finishAchieving a consistent thin flat layer for both nickel and gold is vital when manufacturing PCBs with ENIG finish.
You need to constantly monitor the process, especially when bathing in a liquid solution to achieve this.
The two layers should also be different in their thickness dimension.
The electroless nickel layer needs to achieve a thickness ranging between 4 7 µm.
While the gold layer should vary from 0.05 0.23 µm.
This is one of the fabrication issues that occur when plating with ENIG finish.
This condition arises when the nickel bath contains excessive phosphorus leading to corrosion of the nickel layer.
The black pad can also emerge when there is an excessive gold deposit on nickel in the immersion process.
It is difficult to detect or see the black pad on the board when the plating process is complete.
It also leads to faulty solder joints which crack when there is an occurrence of stress.
This ends up being an irreparable and costly outcome for manufacturers.
Yes, these two plating methods differ in several ways. Some of their differences include;
Some problems arise with the soldering of ENIG solder joints.
For more ENIG Automotive PCB Boardinformation, please contact us. We will provide professional answers.
Among these issues include; Non-wetting and solder joint cracks that cause an electrical continuity failure.
These issues may arise during the surface mount assembly process or when a customer is using the product.
The main cause of such issues is the corrosion of the nickel layer that is commonly called a black pad.
This affects the solder reflow process.
To prevent black pad, you need to take the following measures;
When using this type of surface finish, you can keep your PCB on storage for an average of 12 months.
This type of platting has a longer shelf life in comparison to other finish methods in the PCB industry.
Several standards relate to this type of surface finish.
Some of them are:
This set of standards address the performance specifications for ENIG plating thicknesses.
It specifies the acceptance criteria for its applications including soldering, wire bonding, and contact finish for PCBs.
This standard covers the design and fabrication for ball grid array (BGA) and fine-pitch BGA (FBGA) technology.
It centers on the inspection, repair, and reliability issues that printed circuit boards utilizing these packages may face.
These two forms of PCB finish have varying characteristics.
They compare in the following ways;
This finish needs proper handling as it is prone to oxidation and corrosion from exposure to moisture and humidity.
Its oxidation leads to poor wetting after soldering, which causes defects such as faulty joints bringing about board failure.
Oil and sweat from human hands can also cause tarnishing.
Proper handling of would therefore entail; wearing gloves and storing the circuit board in an airtight package to prevent oxidation.
This is a process of heating ENIG finish PCBs in an oven, intending to drive out moisture.
This process is undertaken before the surface mounting of the boards.
It is important to note that baking can also be damaging to your board if you overlook the right conditions.
You should always consult with your manufacturer to guide you on the appropriate conditions to observe before baking your board.
Selecting the right finish is an important decision that you have to make before fabricating your board.
Some of the key factors to consider are;
Oxidation of such PCBs can happen under certain conditions including;
There are several factors that you should pay keen attention to with this type of surface finish.
Some of them include;
This finishing method uses materials such as gold in its process which is expensive.
On the other hand, this coating method is also not reworkable once defects exist on them.
Therefore, the cost of production becomes sensitive as it can escalate tremendously.
This can occur in some ways if you do not closely monitor the plating process.
It is also not easily detectable and visible and can lead to solderability issues.
Therefore, pay close attention to avoiding black pad existence in your PCB.
Depending on your specific requirements, Venture Electronics offers a range of PCB surface finishes.
Contact us today for all your PCB fabrication needs.
Asking a PCB manufacturer key questions about practices, processes, and certification ensures the quality of PCBs during fabrication and assembly.
Design and engineering teams should have adequate time to prepare questions for PCB manufacturers.
The broad range of capabilities seen with PCB manufacturers requires in-depth questions about quality, processes, and compliance with international standards.
As a parent, you quickly become used to an ongoing stream of questions from your child. On an almost daily basis, parents handle the most important questions of a lifetime. Why? Where did I come from? How did I get here? rank high on my personal list of favorites.
In the business of designing and producing printed circuit boards (PCBs), the ability to ask the right questions can provide value and save money. Within the right environment, asking questions leads to a healthy exchange of ideas and perspectives. Those exchanges foster learning and innovation. The ability to ask questions may also prevent leaders and teams from making decisions that lead to unacceptable risk. In this article, we discuss the critical questions to ask a PCB Manufacturer to establish confidence that you will be getting an excellent product.
Asking the right questions of a PCB manufacturer has roots in best practices and reflects both knowledge and credibility. The right questions allow design and engineering teams to move past surface issues such as availability and discounted costs. When asked the right questions, PCB manufacturers recognize that a team has credibility, knowledge, and insight.
Although asking a PCB manufacturer how many years they have been in business may seem simplistic, the response to that question sets the table for other questions about the type of boards they have produced and whether the products and services match the expectations of your team. For example, if a PCB manufacturer has fifteen years of experience producing rigid boards and has not produced another type of board, the manufacturerdespite 15 years of experienceprobably cannot meet your expectations for producing rigid-flex boards, since they dont have that experience.
Other questions to ask a PCB manufacturer include:
How many employees do you have?
PCB manufacturers that have the appropriate staffing levels have a better ability to sustain best practices when faced with producing larger orders.
What kind of education and training do your employees have?
PCB manufacturers should have the engineering expertise needed for reviewing quick prototype requests and for making recommendations to design teams. Questions of this type often disclose the abilityor lack of abilityof a PCB manufacturer to communicate effectively and to collaborate across different organizational levels.
What is your companys manufacturing philosophy?
PCB manufacturers that place efficiency as a high priority concentrate on delivering products quickly at lower costs. In contrast, PCB manufacturers that value effectiveness begin with a stakeholder analysis and continue by factoring stakeholder requirements into their decisions.
Answers to the above questions can help your team formulate a budget while also showing if time-to-market predictions include stage-by-stage quality control.
Much of the difference between efficiency and effectiveness involves process control. The processes defined by a PCB manufacturer must align with the decisions that your team makes about the board layout, shape, type, materials, and components, and all of this impacts the sub-processes that make up each stage of the larger manufacturing process.
In addition, those processes must match the design specifications for precision and accuracy. Along with other processes, a manufacturer must have the ability to create correct positive and negative images, maintain the alignment of layers within multilayer boards, etch inner and outer layers, drill precise vias and mounting holes, and apply the optimal finishes.
Your teams decisions about components might also impact PCB assembly stages. For example, a decision to use surface mount technology components requires the correct type of pick-and-place equipment. Any use of through-hole components also requires the appropriate wave soldering equipment. Some applicationssuch as aerospace or medical applicationsmay require a PCB manufacturer to have specific board cleaning procedures.
Solid processes should produce a balance between delivering products ahead-of-or-on schedule and ensuring that the quality of the product satisfies or surpasses stakeholder requirements. Any discussion about efficiency and effectiveness should focus on the ability of the manufacturers processes to meet schedules and demonstrate quality control. Questions should touch on the following:
The technologies that a PCB manufacturer uses
Their ability to review board and product designs
The level of error-detection used from the start of manufacturing to the end of manufacturing
Most PCB manufacturers post certification information that demonstrates their commitment to and compliance with international standards. When interviewing manufacturers, ask about their compliance with the International Standards Organization ISO: quality management standard. ISO certification shows that the manufacturer can meet or exceed the needs of its customers through a quality management system that includes company leadership, planning activities, operations, support, and performance management.
Environmental sustainability has become a top priority for the electronics industry. Reputable PCB manufacturers enforce Restrictions of Hazardous Substances (RoHS) standards throughout the manufacturing process. RoHS regulations restrict the use of Lead, Mercury, Cadmium, Hexavalent Chromium, Polybrominated Biphenyls, and Polybrominated Diphenyl Ethers during fabrication. PCB manufacturers must have the ability to provide surface finishes that meet the RoHS requirements. When asking about RoHS compliance, also request information about the manufacturers ability to treat wastewater produced during PCB fabrication processes.
Another key certification for PCB manufacturers involves UL listings. Compliance with the UL listing service shows that manufacturers rigorously test products to protect against flammability and delamination risks. Questions about the capability of a manufacturer to test boards should cover the in-house procedures, the type of in-house equipment, and maintenance procedures.
Key parts of testing procedures include First Article Inspection (FAI) or the testing of the first one or two completed boards to ensure the correct use of materials, the appropriate quantity of materials, the correct application of component mounting, stenciling, and soldering technologies, and an inspection of printing, placement, and soldering. Additional manual inspections, automated optical inspections, and automated X-ray inspections allow manufacturers to check component polarity and locate scratches, open conditions, shorted conditions, incorrect components, missing components, insufficient solder, or excessive solder.
Compliance with the ISO standard assures design teams that a manufacturer has the capability to trace any problems encountered with a board to a root cause. The ability to traceor traceabilityshows that a manufacturer can successfully check production processes, supply chain issues, or maintenance problems. Questions about traceability can cover processes such as the assignment of lot codes for materials arriving from the supply chain, the type of equipment used to perform chemical solution checks, and the assignment of lot and date codes to completed PCBs.
PCB manufacturers should also demonstrate compliance with IPC standards. Those standards cover all classes and types of boards and establish performance and quality levels. The IPC standards also describe quality expectations for the supply chain and the capability of manufacturers to source and trace critical components.
Problems with PCB production can occur between fabrication and assembly. Because an important part of quality involves the storage of PCBs after fabrication, IPC has issued the IPC standard to cover handling for boards. Your design team should ask if the PCB manufacturer uses climate-controlled storage and about the temperatures and humidities observed in the storage facilities. Along with requesting information about the storage facilities, your team should also ask if the manufacturer stores PCBs in a heat-sealed, vacuum-packed moisture barrier bag. Improperly stored PCBs can delaminate after reflow, crack, tarnish, and develop bad solder joints.
Now that you know which questions to ask a PCB manufacturer, check out our PCB Design and Analysis Software page for more cutting edge PCB design advice. Our Allegro PCB Editor can help you bring your next great design to life.
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